Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Semiconductor-packaging/Artikel
    Worldwide silicon wafer shipments decline in Q1 2023, SEMI reports
    Bildquelle nicht angegeben
    Semiconductor-packaging

    Worldwide silicon wafer shipments decline in Q1 2023, SEMI reports

    Worldwide silicon wafer shipments slipped 9.0% quarter-over-quarter to 3,265 million square inches in the first quarter of 2023 and 11.3% from the 3,679
    Veröffentlicht
    03. Mai 2023
    Lesezeit
    1 Minute
    Rubrik
    Semiconductor-packaging

    “The decline in silicon wafer shipments reflects softening semiconductor demand since early this year,” said Anna-Riikka Vuorikari-Antikainen, Chairman of SEMI SMG and Chief Commercial Officer at Okmetic. “Memory and consumer electronics have seen the largest drops in demand while the market for automotive and industrial applications remains more stable.”

    Data cited in this release include polished silicon wafers such as virgin test and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

    Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductors are fabricated.

    The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The SMG facilitates collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

    Mehr aus Semiconductor-packaging

    Weitere aktuelle Artikel aus der Rubrik Semiconductor-packaging.

    Alle Semiconductor-packaging-Artikel
    Nanoscribe Expands Photoresin Portfolio for Micro-Optics Fabrication via Two-Photon PolymerizationFoto: Brecht Corbeel / Unsplash
    Semiconductor-packaging

    Nanoscribe Expands Photoresin Portfolio for Micro-Optics Fabrication via Two-Photon Polymerization

    11. November 2026

    Nanoscribe has detailed its range of photoresins engineered for Two-Photon Polymerization (2PP) and Two-Photon Grayscale Lithography (2GL), targeting high-precision micro-optics manufacturing on silicon, glass, and…

    Canon Launches FPA-6400ES6a KrF Lithography System with 400 Wafers-per-Hour ThroughputFoto: Canon Europe (semicon)
    Semiconductor-packaging

    Canon Launches FPA-6400ES6a KrF Lithography System with 400 Wafers-per-Hour Throughput

    10. November 2026

    Canon has announced the FPA-6400ES6a KrF scanner for semiconductor lithography, combining a throughput of 400 wafers per hour with industry-leading overlay accuracy of 4.0 nm and the ability to handle wafer warpage of…

    Fabmatics absorbs SCI business activities under unified brandFoto: Ludovico Ceroseis / Unsplash
    Semiconductor-packaging

    Fabmatics absorbs SCI business activities under unified brand

    6. November 2026

    Fabmatics has integrated the business activities of SCI under the Fabmatics brand, consolidating the acquired expertise within its semiconductor automation portfolio.

    Entegris and Kioxia Expand Partnership on Materials Innovation for Next-Gen 3D Flash MemoryFoto: Louis Reed / Unsplash
    Semiconductor-packaging

    Entegris and Kioxia Expand Partnership on Materials Innovation for Next-Gen 3D Flash Memory

    6. November 2026

    Entegris and Kioxia are deepening their strategic partnership to co-develop materials and process technologies for future BiCS FLASH 3D NAND architectures, using AI, digital-twin modelling and experimental validation at…

    ← Zurück zu Semiconductor-packagingZur Startseite