Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Semiconductor-packaging/Artikel
    White Knight Fluid Handling Launches ThermaPoint Compact Inline Heaters for Semiconductor Fabs
    Foto: Lightsaber Collection / Unsplash
    Semiconductor-packaging

    White Knight Fluid Handling Launches ThermaPoint Compact Inline Heaters for Semiconductor Fabs

    PFA/PTFE point-of-use heaters target cleanroom space constraints and ultrapure low-flow processes
    Veröffentlicht
    06. Oktober 2026
    Lesezeit
    1 Minute
    Rubrik
    Semiconductor-packaging

    White Knight Fluid Handling has launched the ThermaPoint Compact Inline Heaters, designed for ultrapure and low-flow process applications in semiconductor fabs and life sciences environments. The series features PFA/PTFE wetted surfaces with a tongue-and-groove seal design that eliminates O-ring compatibility concerns when handling aggressive chemistries. Operating in the 1–3 kW power range and supporting 120–240 VAC configurations, the units handle flow rates up to 26 litres per minute.

    The heaters integrate low-mass Heateflex heating coils intended to deliver rapid thermal response and precise temperature control, reducing the risk of overheating in sensitive chemical processes. The compact body measures 2.4 inches in diameter, addressing cleanroom footprint constraints. Safety features include fully encapsulated ground wires and Type J thermocouples for high-limit and process monitoring.

    ThermaPoint will debut publicly at SEMICON West 2026, booth #553, at the Moscone Center in San Francisco from 13 October. The product is positioned for semiconductor process equipment builders and EMS-adjacent fab suppliers managing tight equipment layouts and critical thermal management requirements.

    Quelle: SEMICON Europa – https://www.semi.org/en/node/175991

    Mehr aus Semiconductor-packaging

    Weitere aktuelle Artikel aus der Rubrik Semiconductor-packaging.

    Alle Semiconductor-packaging-Artikel
    Nanoscribe Expands Photoresin Portfolio for Micro-Optics Fabrication via Two-Photon PolymerizationFoto: Brecht Corbeel / Unsplash
    Semiconductor-packaging

    Nanoscribe Expands Photoresin Portfolio for Micro-Optics Fabrication via Two-Photon Polymerization

    11. November 2026

    Nanoscribe has detailed its range of photoresins engineered for Two-Photon Polymerization (2PP) and Two-Photon Grayscale Lithography (2GL), targeting high-precision micro-optics manufacturing on silicon, glass, and…

    Canon Launches FPA-6400ES6a KrF Lithography System with 400 Wafers-per-Hour ThroughputFoto: Canon Europe (semicon)
    Semiconductor-packaging

    Canon Launches FPA-6400ES6a KrF Lithography System with 400 Wafers-per-Hour Throughput

    10. November 2026

    Canon has announced the FPA-6400ES6a KrF scanner for semiconductor lithography, combining a throughput of 400 wafers per hour with industry-leading overlay accuracy of 4.0 nm and the ability to handle wafer warpage of…

    Fabmatics absorbs SCI business activities under unified brandFoto: Ludovico Ceroseis / Unsplash
    Semiconductor-packaging

    Fabmatics absorbs SCI business activities under unified brand

    6. November 2026

    Fabmatics has integrated the business activities of SCI under the Fabmatics brand, consolidating the acquired expertise within its semiconductor automation portfolio.

    Entegris and Kioxia Expand Partnership on Materials Innovation for Next-Gen 3D Flash MemoryFoto: Louis Reed / Unsplash
    Semiconductor-packaging

    Entegris and Kioxia Expand Partnership on Materials Innovation for Next-Gen 3D Flash Memory

    6. November 2026

    Entegris and Kioxia are deepening their strategic partnership to co-develop materials and process technologies for future BiCS FLASH 3D NAND architectures, using AI, digital-twin modelling and experimental validation at…

    ← Zurück zu Semiconductor-packagingZur Startseite