The Internet of Things and its derivate Industry 4.0 are causing a lot of movement in the market. Enormous opportunities are opening up in electronics especially in two areas, on the one hand the production of the relevant systems and the creation of more efficient production, on the other hand the safe, fast and high-rate data transmission.
For this very reason SMT Hybrid Packaging 2015 will take up the subject-matter of Industry 4.0 in the exhibition and the conference. It is the only exhibition in Europe that offers the products, solutions and scientific research required in the field of system integration in microelectronics. With high frequency assemblies and photonic systems the conference will focus on suitable substrates, system designs, assembly technology and modules for high-rate data transmission.
Thanks to the new hall layout the trade visitors will be able to take a tour along the value chain of electronics manufacturing. Hall 6 will showcase the topics „system development and production preparation“ as well as „materials and components“. In Hall 7, the focus will be on „processes and manufacturing,“ which will also feature in Hall 7A in addition to the topics „reliability and test“ and „software and production control“.
I would be very pleased to welcome you at the SMT Hybrid Packaging 5 –7 May 2015 in Nuremberg, Germany.
