Commenting on the sale, Peter Heiland, said, “Although, we have enjoyed tremendous growth with our wafer packer and sorter product line over the past four years, IDE had to decide between being an end user or an OEM-focused company. This sale of our end user products now allows us to concentrate all our energy on our critical OEM customers.”
Lead systems in the transaction are the AWP 200–2 and AWP 300 wafer packer systems. The first mentioned system features a dual robot design for reliable throughput of 150 wafers per hour, along with new patent-pending end-effectors for the handling of thin wafers (including those that are extremely warped) and the precision placement of interleaf materials.
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