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    Startseite/Apex-2017/Artikel
    Versatile, stable, low-voiding solder paste
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    Apex-2017

    Versatile, stable, low-voiding solder paste

    Indium Corporation will feature its void-reducing Indium 8.9HF solder paste to help customers avoid the void at IPC APEX Expo in San Diego, California.
    Veröffentlicht
    13. Januar 2017
    Lesezeit
    1 Minute
    Rubrik
    Apex-2017
    • Demonstrates consistent printing performance for up to 12 months when refrigerated
    • Maintains excellent printing and reflow performance after remaining at room temperature for one month
    • Delivers excellent response-to-pause even after being left on the stencil for 60 hours
    ← Zurück zu Apex-2017Zur Startseite