New technology
“With the new vertical continuous plating (VCP) system, a wide range of different types of printed circuit boards can be manufactured,” the company said. “Thanks to the non-contact transport of PCBs with a thickness of 0.4 mm up to and including 3.2 mm, [we are] well equipped to continue to meet the ever-increasing customer requirements in the area of plating in the future. The copper plating system makes it possible to use a wide variety of materials for high-layer multilayers, but also HDI PCBs and IC substrates. The new line, with a length of 48 meters, is equipped with a fully automatic loading and unloading device as well as an RFID recognition for internal traceability. It offers maximum flexibility in terms of production capacity, copper layer thicknesses, circuit board technologies and dimensions.
“In addition to increased technological flexibility, the new horizontal through-plating line also contributes to significant savings in water and energy and at the same time increases the service life of the chemicals used. The desmear, chemical copper and galvanic Cu pre-amplification process steps run under optimal conditions over a total system length of 58 meters. The process is used for through holes and mechanical blind holes in standard technology, as well as for laser holes (microvias) in HDI and SPU technology with high aspect ratio requirements.
“A very wide range of base materials such as filled and high-Tg materials, RCC foils, multifunctional epoxy resin glass fabrics, thermally-optimized materials and PTFE laminates can be processed in the through-hole plating line. Especially with the latter, the fully automatic loading and unloading units are very advantageous in terms of avoiding mechanical damage.”
With the new construction and installation of state-of-the-art process technology, the company says is meeting the increasing requirements from the automotive, renewable energies, industrial and medical technology sectors.
