Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Aoi-axi/Artikel
    Ultra-fast 2D bottom-side automated optical inspection for PCBs
    Bildquelle nicht angegeben
    Aoi-axi

    Ultra-fast 2D bottom-side automated optical inspection for PCBs

    Saki Corporation announces the release of its new 2DiLU1 inline bottom-side automated optical inspection (AOI) system at SMTconnect.
    Veröffentlicht
    24. April 2019
    Lesezeit
    1 Minute
    Rubrik
    Aoi-axi

    Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces the release of its new 2DiLU1 inline bottom-side automated optical inspection (AOI) system at SMTconnect, Nuremberg, Germany. The company’s 2D line-scan technology is ultra-fast, capturing the image of an entire 460 x 500 mm printed circuit board assembly (PCBA) and carriers of 610 x 610 mm in one pass, in real time, storing the image into memory, and creating inspection data for the entire board. This versatile system automates the bottom-side inspection process, eliminates board flipping and handling, and ensures quality after the potting, dip, wave, and selective soldering processes.

    The 2Di-LU1 software includes the company’s proprietary Fujiyama algorithm, which provides complete through-hole joint inspection in a single step. It simultaneously inspects for copper exposure, pin detection, pin-holes, solder fillet abnormalities, missing components, soldering problems, and bridges. The inspection software has been used for extra component detection of solder balls and foreign objects and through-hole device inspection in the automotive industry for several years and complies with the IPC-A-610 standard.

    “Incorporating bottom-side automated optical inspection into the assembly process increases productivity by reducing the time, costs, labor, and floorspace needed for manual inspection, additional conveyors, or equipment to flip the board,” explained Yoshihiro Akiyama, Chief Technical Officer. “Saki’s system speeds the inspection process, increases throughput, and eliminates extra PCBA handling and the risk of substrate damage.”

    The platform and construction of the 2Di-LU1 bottom-side automated optical inspection system is based on the rigid, time-tested hardware that ensures stable machine performance and long hardware life. The system supports L-size PCBs, high clearances, heavy substrates, and mounted jigs.

    The company will feature its 2D bottom-side AOI system, along with its 3D AOI, SPI, and AXI systems and their Self-Programming Software.

    SMTconnect, Booth 4A-133

    www.sakicorp.com

    Mehr aus Aoi-axi

    Weitere aktuelle Artikel aus der Rubrik Aoi-axi.

    Alle Aoi-axi-Artikel
    TRI's TR7600FB SII 3D AXI System Receives 2026 Mexico Technology AwardFoto: Alexandre Debiève / Unsplash
    Aoi-axi

    TRI's TR7600FB SII 3D AXI System Receives 2026 Mexico Technology Award

    22. Oktober 2026

    Test Research Inc. (TRI) has announced that its TR7600FB SII AI-assisted 3D Automated X-ray Inspection system won the 2026 Mexico Technology Award in the AXI Inspection category, presented at a ceremony preceding SMTA…

    Scienscope to Exhibit AI X-Ray Counting, Inventory Management and Smart Storage at SMTA International 2026Foto: Ludovico Ceroseis / Unsplash
    Aoi-axi

    Scienscope to Exhibit AI X-Ray Counting, Inventory Management and Smart Storage at SMTA International 2026

    13. Oktober 2026

    Scienscope International will present four product lines at SMTA International 2026, covering AI-powered X-ray component counting, automated inventory tracking, X-ray inspection and moisture-sensitive component storage.

    TRI to Showcase AI-Powered AOI, SPI and AXI Systems at SMTAI 2026Foto: Angeles Pérez / Unsplash
    Aoi-axi

    TRI to Showcase AI-Powered AOI, SPI and AXI Systems at SMTAI 2026

    30. September 2026

    Test Research, Inc. (TRI) will exhibit its AI-driven inspection portfolio at SMTAI 2026, highlighting defect detection accuracy above 99% and AI Smart Programming that claims to cut setup time by up to 85%.

    Mek Offers Live Virtual Demo Programme for AOI and SPI System EvaluationFoto: Brecht Corbeel / Unsplash
    Aoi-axi

    Mek Offers Live Virtual Demo Programme for AOI and SPI System Evaluation

    18. September 2026

    Mek (Marantz Electronics) has outlined its live virtual demonstration service, allowing electronics manufacturing engineers to evaluate AOI and SPI systems remotely without travelling to its Netherlands showroom.

    ← Zurück zu Aoi-axiZur Startseite