The exhibition’s highlight will be the production line organised by the Fraunhofer Institute of Reliability and Micro Integration and entitled: „PCB Packaging for Medical”. Using the live demonstration, experts from industry and research will demonstrate the technological parameters and the demands on the equipment. Under the heading „Embedding technologies and their impact on the value chain of printed circuit boards”, the conference programme on Wednesday (held in German) will highlight one of the topical issues of the day. The conference will cover all aspects of the integration of new functions using embedding technologies within the scope of PCB technology. Two sessions will focus on the latest expertise in PCBs, assembly technologies, as well as applications and market opportunities. In the first, experts from well-known companies and institutions (such as AT&S, Koenen, Schweizer Elektronik, Datacon, Würth and Fraunhofer IZM) will focus in particular on the key technologies for embedding active and passive components, such as stencil technology, multilayer integration, assembly technologies and integrated manufacturing processes. The second session which will look at applications and market opportunities will provide feedback from the different sectors where these technologies have been applied, such as automotive electronics, power and opto electronics, medicine and avionic as well as through a comparison with standard HDI. This session has attracted outstanding papers from leading companies (e.g. Continental, EADS, Infineon, MSE, db-electronics, Vario-Optics, Maris Techcon). The conference will also include papers on high value applications of embedding-technologies, integration of optical components, assembly technologies for special products and the latest insights into market development. In addition to the conference day, 20 practice-oriented tutorials, 4 of them in English, will complete the program. These will concentrate on technical highlights, logistical topics and visionary approaches. Well known experts will provide answers to the challenges faced everyday by developers, manufacturers, suppliers and users. The tutorials (held in English) will be: Package on Package (PoP), Stack Assembly, Rework and Inspection by Bob Willis, BGA/CSP/WLP/LGA Reliability in Packaging & Assembly Applications by Jennie S. Hwang, Reliability Issues with Lead-Free Soldering by Werner Engelmaier and Critical Fundamentals in Solder Joint Reliability by Jennie S. Hwang.
