- Lead in high melting point solders (i.e. lead based solders containing 85% by weight or more lead)
- Lead in solders for servers, storage-array systems, network-infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications
- Lead used in compliant pin-connector systems
- Lead as a coating material for the thermal-conduction module C-ring
- Lead and cadmium in optical and filter glass
- Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip-chip packages
- Two applications have been rejected:
- Optical transceivers for industrial applications
- Safety equipment for fire and rescue services
