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    Testing of power semiconductors
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    News

    Testing of power semiconductors

    SEICA has confirmed that it will be showcased two new solutions at the upcoming PCIM Expo & Conference, which is set to take place from May 6–8 in the
    Veröffentlicht
    02. Mai 2025
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    2 Minuten
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    The new solutions on show are the S20 IS³ and the S20 RTH, both of which are dedicated to the testing of semiconductors.

    The S20 IS³ system is designed for testing discrete power devices, including SiC and GaN technologies. Designed for both AC and DC static and dynamic testing, it performs accurate and repeatable characterization of electrical parameters, a crucial process that ensures reliability and performance of components such as IGBTs, MOSFETs, and diodes.

    Static tests measure key parameters such as on-state voltage (Vce, Vds), leakage current (Ic, Id), and threshold voltage (Vth), ensuring the device meets its electrical specifications. Dynamic tests evaluate switching characteristics, including turn-on/off times, rise/fall times, and energy losses, which are critical for real-world applications.

    The system is configurable and able to perform high precision measurements, providing reliable and repeatable results, and has a compact, space-saving design with one-box integration of DC-Static, Gate, AC-Dynamic testing.

    The S20 RTH test bench is designed to deliver precise thermal resistance (RTH) characterization with advanced power and cooling management capabilities. Among all semiconductor devices, transistors are by far the most important category and nearly all of them are three-pin devices (MOSFETs, BJTs, IGBTs). Unlike diodes, they have a driving section which makes them more sensitive to issues related to the interaction between power handling and the input signal. In modern power supply design, more and more attention is given to the electrical efficiency of the overall system and to the junction temperature of semiconductor devices, and this kind of test evaluates the thermal stress on power MOSFET devices when they are used in switch mode power supplies. By this computation and with the physical characteristics of the device, it is possible to predict the temperature reached inside the junction, and the allowable margin or heatsink required to assure that the system has a suitable thermal margin during operation. This approach is fundamental because correct computation allows for a more accurate evaluation of system lifetime and assures working operation within the Safe Operating Area.

    The S20 RTH can safely handle high current loads (standard configuration is 1200A @15V or 30V), ensuring accurate thermal performance evaluation under real operating conditions.

    Seica’s power switching hardware is a key element of the test architecture, enabling a programmable controlled shutdown of the load current which minimizes oscillations, allowing the system to perform precise measurements as soon as 80us after the high current shutdown. The configuration of the bench is scalable, starting from 2 Devices Under Test (DUTs) up to 12 DUTs tested in parallel, depending on throughput needs. The temperature, flow and pressure of the coolant to each DUT is automatically measured and controlled by the system, optimizing thermal stability and ensuring reliable measurements.

    www.seica.com

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