Technic will participate in SEMICON Europa 2026, co-located with electronica at Messe München, showcasing its Elevate® series of high-performance electroplating processes. The portfolio covers copper, nickel, tin, and precious metal plating systems engineered for advanced semiconductor fabrication and packaging workflows.
Two recently added products headline the exhibit: Elevate® Cu 3000 and Elevate® Cu 1500. The Cu 3000 targets 2.5D and 3D integration, offering flexible feature profiles and coplanarity across a wide current density range, while the Cu 1500 addresses high-reliability interconnects through via-fill capability and surface leveling for AI and next-generation semiconductor applications.
Alongside its plating chemistries, Technic supplies photoresist strippers, metal etchants, and cleaning solutions for surface preparation. The company states it is actively developing more sustainable wet-process chemistries aimed at reducing environmental impact without compromising performance in advanced-node manufacturing.
Quelle: Technic (semicon) – https://www.technic.com/about/news-events/news/technic-returns-semicon-europa-2026
