Technic Asia Pacific (TAP) has announced a significant expansion of its Singapore facility, adding analytical instrumentation and production infrastructure to serve the semiconductor industry in Southeast Asia. The Failure Analysis and Wafer-Level Packaging laboratories have been equipped with ICP-MS for trace element detection, GC-MS for volatile organic compound characterisation, and liquid particle counting for contamination monitoring. Both laboratories operate as Class 100K cleanrooms. A wet laboratory extension adds accelerated corrosion testing and non-destructive XRF analysis for coating thickness and composition, supporting Technic's surface finishing portfolio.
On the production side, a new 1,000-litre blending rig enables local manufacture of Technic's plating chemistries. The system incorporates 0.1 µm filtration and controls inorganic trace metal contamination to ppb levels, meeting particle cleanliness and trace contaminant specifications relevant to advanced packaging processes. Local blending is intended to reduce lead times and improve supply flexibility for customers in the region.
The combined investment positions TAP to support customers across the full process development cycle — from application testing and process optimisation through to quality analysis and troubleshooting — at a time when semiconductor manufacturing capacity in Southeast Asia continues to expand.
Quelle: Technic (semicon) – https://www.technic.com/about/news-events/news/strengthening-semiconductor-capabilities-southeast-asia
