The company says its system can achieve 56.8cm2/sec. inspection speeds under optimum conditions, with accuracy ensured by its 8-way projectors and 4-way oblique imaging through its 20 Megapixel angle cameras. Lens/coaxial lighting options ensure very high resolution, well-suited to device inspection.
Notable features include the following:
- New 5um resolution for narrow pitch 0201mm devices;
- New co-axial lighting system for finding defects in reflective surfaces;
- New camera and projector system that offers improved inspection capability;
- New AI supported easy programming and job creation;
- New unified YR platform machine interface.
Most notably, it can convey large PCBs, with L610mm and W610mm dimensions as standard. The newly- developed dual lane system can convey large PCBs with W320mm on the two lanes and operate dynamically with 1 fixed and 3 moving rails. The system can be easily connected to upstream and downstream equipment; this contributes to establishing dual lane flexibility.
