Following an agreement with Phil-ips Research for the exclusive rights to commercialize STT and advanced semiconductor on insulator gluing sys-tem (ASIGS) methods developed jointly with them, in addition to a commitment to conduct further joint research and development, Em Technologies has launched a substrate-bonding machine, enabling users to develop semiconductor-on-anything (SOA) process capabilities – including silicon-on-glass (SOG). Essentially a post-processing step, STT exploits the advantages offered by replacing bulk silicon substrates with improved insulating materials, eliminating the performance-limiting role that interconnect capacitances play in silicon substrates as feature sizes become ever smaller. The start-up’s second focus area is the emerging MST/MEMS arena, to provide a modular manufacturing platform, which can be extended and optimized by a variety of process and assembly mo-dules.
