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    Startseite/Aoi-axi/Artikel
    Stencil technology in the third dimension
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    Aoi-axi

    Stencil technology in the third dimension

    Modern PCBs with a high packing density and a mixture of SMD and THT components are constantly becoming more complex, increasing the demands placed on
    Veröffentlicht
    06. September 2010
    Lesezeit
    1 Minute
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    Aoi-axi
    • Adaptation to the paste requirement of the component
    • Change of the stencil thickness
    • Compensation for substrate unevennesses / multiple printing
    • Cavities in the bottom side of the stencil
    • Printing on different levels
    • Parallel printing levels in one stencil

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