Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/News/Artikel
    Statistical program results released for November 2017
    Foto: Anne Nygård / Unsplash
    News

    Statistical program results released for November 2017

    IPC announced the November 2017 findings from its North American Printed Circuit Board (PCB) Statistical Program.
    Veröffentlicht
    03. Januar 2018
    Lesezeit
    1 Minute
    Rubrik
    News

    IPC — Association Connecting Electronics Industries announced the November 2017 findings from its North American Printed Circuit Board (PCB) Statistical Program. Positive year-over-year shipment and order growth continued in November. Total North American shipments were up 4.0 percent compared to the same month last year. This year to date, shipments are 2.3 % below the same period last year. Compared to the preceding month, November shipments increased 0.4%.

    The book-to-bill ratio also remained high in November at 1.09. PCB bookings increased 15.8% year-on-year, raising year-to-date order growth to 5.7% above the same period last year. Bookings in November were down 3.8 % compared to the previous month.

    “The outlook is positive, based on strong order growth in recent months, and on PCB book-to-bill ratios above parity (1.0) for 10 consecutive months. Although it has been retreating from a 12-year high in August, due to growth in sales, it remains strong, indicating a likelihood of continued sales growth in the coming months,” said Sharon Starr, Director of market research.

    Detailed data available

    The next edition of North American PCB Market Report will be available the week of January 8, 2018. The monthly report presents detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by company size tiers, demand for prototypes, and other timely data. More information about this report can be found here.

    www.ipc.org

    Mehr aus News

    Weitere aktuelle Artikel aus der Rubrik News.

    Alle News-Artikel
    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in GermanyFoto: Laurens van der Drift / Unsplash
    News

    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in Germany

    9. November 2026

    German distributor Microtronic has announced it will represent iRaptor LDA and its EYE thermal profiler in Germany. The Portuguese developer's system extends beyond conventional 2D time-temperature profiling by…

    Indium Corporation Presents Solder Materials Research at SMTAI 2026Foto: Indium Corporation
    News

    Indium Corporation Presents Solder Materials Research at SMTAI 2026

    29. Oktober 2026

    Indium Corporation is fielding five specialists at SMTA International 2026 to present new findings on solder paste rheology, BGA ball alloy selection for lower-temperature reflow, and the effect of print gap on paste…

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026Foto: Vishnu Mohanan / Unsplash
    News

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026

    16. Oktober 2026

    KYZEN will exhibit its AQUANOX line of aqueous electronics cleaning chemistries at SMTA International, October 27–29, 2026, highlighting prolonged bath life as a process efficiency and cost-reduction lever for…

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT LinesFoto: Cybord
    News

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT Lines

    29. August 2026

    Fuji America Corporation and Cybord have announced a strategic partnership to embed AI-powered component analytics directly into SMT production lines, enabling 100% real-time inspection of electronic components during…

    ← Zurück zu NewsZur Startseite