- “Experience with 01005 Components,” a presentation by H. Adelsberger, Siemens AG;
- “Reflow Against the Background of the Actual Trend in Electronic Products” by M. Rösch, University of Erlangen;
- “Equipment and Process Requirements in Reflow From the User’s Perspective” by Dr. F. Christoph, Siemens AG;
- “System Solutions for Cleaning In Electronic Manufacturing” by G. Pohlmann and W. Kolb; Kolb Cleaning Technology;
- “User Experience with Selective Soldering” by Martin Lotz, Wabco;
- “Solder technology in the Future for Selective and Wave Soldering” by D. Kil and G. Diepstraten, Vitronics Soltec;
- “Lead-Free Wave Soldering” by J. Steuer, Neways; and
- “Modern User Interface” by B. V. Seeters, Vitronics Soltec.





