Built for speed, designed for precision
The suite enhances operational efficiency for users of RECIF’s COMPACT and SMART sorters, featuring advanced capabilities and a modern interface designed to streamline wafer sorting processes.
The key features include:
- Refined user interface, its design making it easier to create recipes and monitor jobs, ensuring smoother operations and increased productivity;
- seamless transition, providing current users with minimal disruption when transitioning to the new suite, owing to an intuitive interface that simplifies adoption; and
- ongoing software enhancements: built on a forward-compatible framework, the suite will have updates released annually to deliver new features and performance improvements. The first major update was rolled out in January 2025, with the next release scheduled for the first quarter of next year.
Commitment to innovation and user experience
The release of the software reinforces the company’s commitment to providing high-performance solutions for the semiconductor industry. By focusing on a more intuitive and efficient wafer sorting process, the software is the first in a series of improvements designed to elevate both the user experience and operational efficiency.
“We believe R.PACK will significantly enhance our customers’ workflows and performance,” commented Thomas Brillouet, R&D Manager at the company. He added: “By providing enhanced features and a modernized interface, we empower our customers with tools that maximize safety, enhance efficiency, and optimize equipment performance with minimal effort.”
