The award was presented to the company during a ceremony that took place at the Mandalay Bay Resort & Convention Center in Las Vegas before the start of Apex 2010.
The SMT Vacuum Plus N2 module is an independent unit which can be integrated in an SMT Reflow Soldering System. Due to the modular design of the SMT Reflow Soldering System our new Vacuum Plus module can easily be retrofitted into an existing SMT Reflow Oven. The Vacuum Plus unit is positioned immediately after the peak zone, and can be utilized when required. The continuous reflow pass is then automatically switched to vacuum operation. The product is exposed to a vacuum for a short period of time during the soldering process. Voids in the solder joint are reduced to a minimum, which improves significantly its quality. This is very important for all critical PCB’s in the automotive, telecommunication, aerospace, defence and medical industry. Direct integration into the system provides the manufacturer with a high degree of flexibility, and is significantly more economical than a separate system.
SMT/Hybrid/Packaging
Booth 9-128
