The GSPMO report provides comprehensive data and forecasts for substrates, leadframes, bonding wire, and additional advanced packaging materials.
“After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024,” said Lita Shon-Roy, TECHCET President and CEO. “The global packaging materials market is expected to exceed USD 26 billion by 2025 and continue solid growth through 2028.”
“Substrates account for a large portion of the revenue for the packaging materials market, and within the category, FC-BGA substrates make up the majority of the revenue growth,” said Jan Vardaman, President of TechSearch International. “The CAGR for flip chip BGA/LGA revenue is expected to be 7.6% from 2023 to 2028. Other key growth areas include wafer-level packaging (WLP) dielectrics and flip chip underfill. The laminate substrates segment is expected to grow 7.3% annually in volume, while leadframes and bonding wire are also forecasted to recover, growing by 5.0% and 6.4%, respectively.”
