This year’s Advanced Packaging Conference (APC) will focus on:
- Megatrends and Opportunities for Advanced Packaging and Front-End Integration
- Smarter Supply Chain Solutions for a Sustainable Ecosystem
- Testing and Reliability
- System in Package (SiP) Requirements for Future Applications
- Power Electronics Packaging
Speakers include experts from AT&S, Atotech an MKS Brand, Cohu, Comet Yxlon, Elmos Semiconductor, Evatec, Fraunhofer Institutes, GlobalFoundries, Henkel, imec, Infineon Technologies, JCET Group, Koh Young Europe, Merck, ProSys, STMicroelectronics, and TSMC.
The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, Merck, Panasonic Connect and Resonac Europe.
Fab management forum
- Fab Expansion Landscape: Opportunities and Challenges
- Industrial Collaboration Models
- Poster Session: Industry Meets Innovative Ideas
- Cultivating the Workforce of Tomorrow
- Solutions Enabling the Path to Net Zero
- Smarter Manufacturing for a Connected Ecosystem
Speakers include experts from Applied Materials, D-SIMLAB Technologies, INFICON, Infineon Technologies, Intel, Qualcomm, Robert Bosch, Schneider Electric, STMicroelectronics, Texas Instruments, Tokyo Electron Europe, Watlow, Wolfspeed, and X-FAB.
The forum is sponsored by Comet Yxlon, Edwards, Flexciton, INFICON, Sachsen-Anhalt, Schneider Electric, Tokyo Electron Europe (TEL), and Watlow.
Visit Semicon Europa for more information.