SEMICON Europa 2022 will convene experts and technologists for insights into the latest technology, materials and process innovations powering digital transformation and the next wave of semiconductor industry growth. The event will spotlight cutting-edge solutions that enable chipmakers to implement a broad range of new application-specific technologies.
Advanced Packaging Conference ─ Advanced Packaging Solutions in the Era of Digital Transformation
Advanced electronics packaging are integral to the system solutions required to enable mega trends in computing and communications and leading applications in markets such as medical devices and automotive. With collaboration critical to technology advances, experts from across the semiconductor supply chain who are driving innovations, technology concepts or roadmaps are invited to submit abstracts on advancements in the areas of Packaging/Assembly, Wafer/Package Test and Modelization. The submission deadline is June 10, 2022.
Fab Management Forum ─ Industry Meets Academia
New university graduates and young innovators looking to launch careers in the semiconductor industry will present their research and early-stage products to established fab managers. Key topics of interest are the Status of AI in Microelectronics Manufacturing and Advanced Analytics and Digital Twins for Faster, More Precise Decision Making. Students with doctorate and master’s degrees and their professors, as well as postgraduate researchers, research institutes and early start-ups and spinoffs, are invited to submit abstracts by June 17, 2022.
Pre-recorded Presentations
In addition to the in-person programs, experts are invited to submit abstracts for the pre-recorded sessions on Friday, November 18. All pre-recorded presentations will be available to SEMICON Europa attendees onsite and virtually through the event website. The submission deadline is July 31, 2022.
Presentation abstracts, biographies and headshots must be submitted on the SEMICON Europa 2022 Call for Abstracts webpage. The conference language is English. All selected presenters will be notified in July 2022.
