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    Startseite/Semiconductor-packaging/Artikel
    SEMI Publishes Nine-Point Position Paper on EU Chips Act 2.0
    Foto: Chris Ried / Unsplash
    Semiconductor-packaging

    SEMI Publishes Nine-Point Position Paper on EU Chips Act 2.0

    Industry body calls for expanded First-Of-A-Kind framework and faster investment processes across the semiconductor value chain
    Veröffentlicht
    09. September 2026
    Lesezeit
    1 Minute
    Rubrik
    Semiconductor-packaging

    SEMI has published a position paper urging European policymakers to use the proposed Chips Act 2.0 to reinforce Europe's position in the global semiconductor ecosystem. The nine recommendations cover an expanded First-Of-A-Kind framework spanning the full semiconductor value chain, faster and more predictable permitting and investment processes, stronger industry participation in governance, and an ambitious EU budget allocation.

    The paper also addresses Europe's production-cost disadvantage, alignment of demand-side initiatives with existing industry structures, industry-led supply chain monitoring, and workforce development. SEMI President Europe Laith Altimime noted that competitiveness depends on the entire ecosystem, from design and materials through to equipment, manufacturing, and advanced packaging.

    SEMI states that several elements in the European Commission's draft legislative text already reflect priorities raised by its members, and the organisation intends to continue engaging with EU institutions and member states throughout the co-legislative process.

    Quelle: SEMICON Europa – https://www.semi.org/en/semi-press-release/semi-calls-on-the-chips-act-2.0-to-strengthen-semiconductor-competitiveness-and-resilience

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