The series can be configured with single or dual lanes, and one, two or three heat stations depending on capacity, process control, application, and footprint requirements. As process needs change, the platform can be upgraded in the field and configured to meet specific dispensing requirements, from simple dots of silver epoxy or solder paste to underfilling flip chips with extremely tight keep-out zones. The dual-lane configuration is ideal for applications with long preheat cycles or long flow-out times. Dispensing can be done in one lane while parts in the second lane reach temperature set point or flow-out occurs.
The platform takes advantage of Asymtek’s patented non-contact jetting technology for applications such as stacked die underfill, chip scale package (CSP) underfill, and UV gaskets for liquid crystal displays (LCDs). Dispensing into narrow 200 micron gaps between components, shields, or into slots can be difficult or impossible with needle dispensing because the needle might not fit, can clip and damage the die, or require needle calibration to compensate for bent needles. This kind of jetting overcomes these limitations while offering high-speed dispensing with flow rates up to 500 mg/second and shot rates up to 200 dots/second. The system footprint is 600 x 1321 mm (23.6 x 52.0 “) with a single heat station, 850 x 1321 mm (33.5 x 52.0 “) for two heat stations, and 1100 x 1321 mm (43.3 x 52.0“) for three heat stations.
EPP Europe 431
