Highlights at the company’s stand (Booth 817) will include:
- High-Performance Underfill (UF 120HA2): 100% compatible with no-clean flux residue; passes 10×260°C reflow without cleaning; low CTE for superior reliability; fast flow and rapid cure for efficient assembly.
- Advanced Die Attach Materials (TM 230–2): low-void, high-reliability solutions; low-temperature process compatibility; options for both soldering and sintering for large-die applications.
- Next-Generation Liquid Metal Solutions (TM 150LM): high viscosity and superior reliability; no blow-out or pump-out, even under thermal cycling; exceptional heat dissipation for TIM1, TIM1.5, and TIM2 applications.
Dr Wusheng Yin, CEO at the company, commented: “Our portfolio demonstrates a unique combination of thermal performance, reliability, and process efficiency. We are excited to showcase materials that enable the future of advanced packaging and high-power devices.”
