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    Sales and service from one source

    The restructuring of BE Semiconductor Industries N.V. (Besi), completed last fall, focused on the centralization of certain global developing,
    Veröffentlicht
    11. April 2008
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    There are three aspects to the restructuring: First, integration of Laurier (die sorters) with Datacon (die bonders); second, consolidation of all product activities for packaging equipment and third, consolidation of all sales and service activities for die bonding, die sorting and packaging equipment, and their integration into a global organization. The integration of Laurier with Datacon will mean that the die-sorting products will now be developed and looked after under the Datacon brand.

    A consolidation of the product activities for packaging equipment primarily affects the Fico departments for molding, trim-and-form and singulation equipment: Development and production of these three units will be handled under a management structure to simplify the product development and decision-making and to reduce the overhead of the subsidiary companies.

    The reorganization of Besi’s sales and service activities is focused on the integration of the sales and services activities for the systems for die sorting, die bonding and package assembly, which previously ran in parallel. Their individual organizations are being consolidated worldwide into Besi’s new global sales and service organization, which is also taking over the complete after-sales support for all products.

    In this way, redundant sales and service overhead can be eliminated and the company’s management structure simplified. As head of this newly created organizational unit “Besi Sales and Customer Support”, Michael Auer (see figure), who has been responsible for worldwide sales at Datacon for the last four years, can crucially improve Besi’s market coverage and customer presence and strengthen the company’s competitive position.

    www.besi.com

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