SAKI Corporation has announced the 3Xi-ZS1EX Automated X-ray Inspection (AXI) system, engineered specifically for XXL-sized PCBs increasingly deployed in data-centre and high-performance computing applications. The system integrates high-resolution 3D X-ray imaging with SAKI's proprietary AI-based image analysis and delivers approximately 1.6 times higher takt time compared to previous SAKI AXI models, while maintaining the company's established high-rigidity platform architecture.
A key capability is automatic board warpage correction, which compensates for surface variations across large-format assemblies — a critical requirement as board size increases and warpage becomes more pronounced. The 3Xi-ZS1EX also supports 3D CT inspection of tall components such as press-fit pins, which are difficult to assess with conventional 2D X-ray or AOI methods. SAKI states the system achieves this within a compact machine footprint, making it viable for space-constrained SMT production lines handling server and AI accelerator board assemblies.
Quelle: SAKI Corporation – https://www.sakicorp.com/en/news/newsrelease/4825/
