Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/News/Artikel
    Research collaboration seeks to advance semiconductor metrology solutions
    Bildquelle nicht angegeben
    News

    Research collaboration seeks to advance semiconductor metrology solutions

    Semiconductor metrology specialist Nearfield Instruments and the A*STAR Institute of Microelectronics (A*STAR IME) of Singapore have signed a multi-year
    Veröffentlicht
    27. Mai 2025
    Lesezeit
    2 Minuten
    Rubrik
    News

    By leveraging the company’s expertise in high-precision metrology, and the institute’s cutting-edge semiconductor research, the partnership aims to accelerate the development of advanced metrology solutions that enable efficient AI chip production.

    The rapid rise of AI is driving high demand for compute power, presenting opportunities for innovation in semiconductor technology. As traditional semiconductor scaling reaches its limits, the industry is turning to heterogeneous integration—the advanced packaging of different types of chips into a single system—to achieve exceptional compute performance and enhanced energy efficiency. This shift introduces greater complexity in manufacturing and underscores the critical importance of process control and precision metrology to ensure production yield and efficiency.

    Hamed Sadeghian, CEO at the company, commented: „AI is changing everything but its success depends on compute efficiency as well as manufacturing efficiency.” He added: “[We are working to enable] the AI revolution by providing the metrology solutions needed to tackle the challenges of heterogeneous integration, with a specific focus on hybrid bonding. By ensuring precision and reliability, we help manufacturers scale AI chips efficiently, improve yields, and reduce energy waste. Our collaboration with A*STAR IME strengthens our ability to develop breakthrough solutions for the future of AI-driven computing.”

    The collaboration aligns with Singapore’s continuous efforts to strengthen its semiconductor industry through strategic partnerships with global technology leaders.

    Chang Chin Nam, Senior Vice President and Head of Semiconductors, Singapore Economic Development Board, commented: “This partnership highlights Singapore’s commitment to supporting cutting-edge semiconductor process control research, critical for the development of next generation semiconductors used in applications such as AI. He added: [We] look forward to further research and supply chain collaborations within Singapore’s growing semiconductor ecosystem.”

    www.nearfieldinstruments.com

    Mehr aus News

    Weitere aktuelle Artikel aus der Rubrik News.

    Alle News-Artikel
    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in GermanyFoto: Laurens van der Drift / Unsplash
    News

    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in Germany

    9. November 2026

    German distributor Microtronic has announced it will represent iRaptor LDA and its EYE thermal profiler in Germany. The Portuguese developer's system extends beyond conventional 2D time-temperature profiling by…

    Indium Corporation Presents Solder Materials Research at SMTAI 2026Foto: Indium Corporation
    News

    Indium Corporation Presents Solder Materials Research at SMTAI 2026

    29. Oktober 2026

    Indium Corporation is fielding five specialists at SMTA International 2026 to present new findings on solder paste rheology, BGA ball alloy selection for lower-temperature reflow, and the effect of print gap on paste…

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026Foto: Vishnu Mohanan / Unsplash
    News

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026

    16. Oktober 2026

    KYZEN will exhibit its AQUANOX line of aqueous electronics cleaning chemistries at SMTA International, October 27–29, 2026, highlighting prolonged bath life as a process efficiency and cost-reduction lever for…

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT LinesFoto: Cybord
    News

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT Lines

    29. August 2026

    Fuji America Corporation and Cybord have announced a strategic partnership to embed AI-powered component analytics directly into SMT production lines, enabling 100% real-time inspection of electronic components during…

    ← Zurück zu NewsZur Startseite