Only 15% of respondents currently use 50% or more lead-free solder – a figure that is expected to rise dramatically during the next year. It is expected that Japanese production will be close to 100% use by the end of 2005. Almost half indicated a belief that lead-bearing technology will co-exist with lead-free production based on exemptions, export and repair needs. The freely accessible report also contains information about preferred materials and processes being selected by manufacturers. While a majority continues to prefer the SnAgCu (SAC) alloy for reflow and hand soldering, the SnCuNi alloy appears to be competing strongly for wave soldering. There is a greater diversity in choice of lead-free surface-finish materials, with the trend towards NiAu or pure tin remaining. 62% were still undecided on preferred materials for BGA solder balls. Elfnet is committed to continue to work during 2005 to encourage collaborative progress by the key players from both industry and research. It is currently deploying a set of working groups to put in place realistic solutions based on a list of priority implementation issues identified by Europeans experts. (gbw)
EPP EUROPE 401
