The focus at the trade fair in San Diego is technological innovations in electronics manufacturing “Turn toward the future” – IPC APEX Expo invites specialist visitors to San Diego, California from 14 to 16 February 2017 under this banner. Rehm Thermal Systems is once again present at this major electronics trade fair this year, and presents its latest plant technology for reliable reflow convection and condensation soldering at booth 1901.
The company will present the following new thermal system solutions:
VisionXP+ Vac, the 2-in-1 solution for reflow convection soldering, combines many further developments, in particular with regard to optimizing energy efficiency and reducing emissions. Customers can save up to 20% energy in electronics manufacturing with this system, consuming an average of 10 tons less CO2 per year. The vacuum option makes condensation soldering processes possible with or without vacuum for the first time – all in one system! The VisionXP+ Vac reliably vacuums gas inclusions and voids during soldering while the solder is still in its ideal molten state. With a vacuum of up to 2 mbar, void rates of less than 2% can be achieved.
The new ViCON software will also be presented in the area of Smart Data and networking, featuring a touchscreen user interface. The German machine manufacturer has developed an innovative solution for easy operability and optimal traceability in the VisionX series. For example, the software can monitor all values that have changed, or collect and statistically evaluate alarms in order to avoid errors and to optimize machine settings.
Reflow condensation soldering with the CondensoX series carries out the soldering process by means of hot steam and the Galden medium. Large, heavy boards can be processed without a problem since the heat transfer is up to ten times higher than with convection soldering. The use of the injection principle and the control of temperature and pressure ensure accurate and diverse reflow profiling. The company will present the new CondensoXC at the trade fair. The plant is a particularly space-efficient, high-performance system in the CondensoX series, and ideal for laboratory applications, small batch production, or prototyping. Void-free soldering can be easily implemented in all systems of the series with the vacuum option.