The Tarantula Dual Lane is the company’s most advanced dispensing platform to date, designed to combine speed, precision, and versatility in a single compact footprint. With its dual-lane architecture, the system enables independent processing on two lanes simultaneously, delivering significant productivity gains without increasing floor space.
“Winning this award at productronica is a true honor,” commented Pierre-Jean Cancalon, Head of Marketing and Communications at Essemtec. “The Tarantula Dual Lane was engineered to give manufacturers the highest level of flexibility for high-speed lines, while maintaining the exceptional quality and versatility Essemtec is known for.”
The platform features next-generation control technology for faster, more precise jetting and dispensing, supporting real-world performance of 350,000 dots per hour in average with Jet-on-the-Fly solder paste jetting and a maximum frequency of 1,100,000 dots per hour. Its ability to integrate up to three dispensing valves in one system allows manufacturers to combine multiple processes—such as solder paste jetting, glue or epoxy jetting, and contact dispensing—without additional equipment.
Beyond performance, the solution is designed to maximize production quality with optional 2D solder paste inspection (SPI) and auto-correction, integrated traceability, and a holistic approach to process control. These features help improve first-pass yield, reduce rework, and enhance overall process stability.
Manufacturers also benefit from reduced costs and lower environmental impact. The solution minimizes material waste by jetting the exact amount required, eliminates the need for stencil cleaning chemicals, and reduces overall line complexity by replacing multiple machines with one. It could also complement a traditional screen by eliminating stepped stencil designs, applying solder exactly where needed—in cavities, for example—or for ultra-fine pitch and special components.
Ease of use remains a hallmark of Essemtec platforms. The Tarantula Dual Lane leverages the company’s intuitive ePlace software, optimized job preparation tools, and compatibility with EasyLogix PCB-Investigator, making setup faster and more efficient. Its modular design, software upgrade options, and remote diagnostics ensure a long lifecycle and protect manufacturers’ investment. The IPC Hermes and CFX are also supported to ensure a seamless integration into any factory environment.
With its winning combination of scalability, precision, and sustainability, the Tarantula Dual Lane aims to set a new standard for dispensing and jetting equipment in high-volume electronics manufacturing.
