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    Printed boards in times of 3D silicon integration
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    News

    Printed boards in times of 3D silicon integration

    While the global electronics industrie suffers from the financial and economic crisis, Moore´s law still is driving electronics to further miniaturization
    Veröffentlicht
    08. April 2009
    Lesezeit
    1 Minute
    Rubrik
    News
    • a new, cheap flex laminate technology, based on a process for electroless Cu deposition on polyimide
    • a new lamination technology, based on interconnection by solid state diffusion
    • component embedding technologies : resistors, capacitors, RF components and ultrathin (20 micron) chips
    • assembly technologies on embedded multilayer flex

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    News

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    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026Foto: Vishnu Mohanan / Unsplash
    News

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026

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    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT LinesFoto: Cybord
    News

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT Lines

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