- Precise control of solder volume dispensed per pad/interconnect area
- PCB edge sensing accuracy – absolutely critical for this atypical dispense application
- Ability to dispense varying solder paste types (including types 3 through 6)
- Ability to dispense pastes via varying needle sizes (IDs);
- Precise line (solder bead) width dispense accuracy
- Repeatable consistency of deposition over high volume/throughput.





