Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, has announced today their plans to exhibit in Booth #1223 at the 2017 IPC APEX Expo, scheduled to take place Feb. 14–16, 2017 at the San Diego Convention Center in California. The company will debut the FOX² and demonstrate the compact Spider Jet Dispenser.
The new FOX2 combines jetting of solder paste or glue and placement in a single machine. The new version is based on the original platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments. The system has a machine footprint of just 1 m2 and can accept PCB sizes up to 16×12“. Components with sizes from 01005 up to 1.3×3.1“ are placed. The machine achieves 7,500 cph (IPC9805A) at 50 µm, 3 sigma with a two-nozzle head.
The Spider can utilize two dispensing jet valves rated at up to 150,000 dots per hour. It dispenses 3D patterns and can be easily adapted to your application. The system occupies only 1 m² of floor space and features linear motor drives for high accuracy: 40 µm (3 σ) at full speed. Job changeover is quick with intuitive CAD import and job preparation. Mapping of heights by laser technology enables 3D applications. A mineral-cast chassis provides stability at varying temperatures.