Advanced 3D inspection systems innovator PARMI USA will launch its next-generation 3D Automated Optical Inspection (AOI) system, the Xceed II, at the IPC APEX EXPO 2025. The expo will take place from March 18-20 at the Anaheim Convention Center in California and PARMI will showcase its latest advancements in inspection technology—including the Xceed II—at Booth 910.
The Xceed II features an enhanced platform designed to improve inspection speed and quality. This new system incorporates the TRSC-II sensor, delivering superior 2D/3D data quality and offering five different resolution settings, ranging from high precision (4 µm, 6 µm, 7 µm) for detailed inspection to high-speed settings (10 µm, 14 µm) for faster throughput.
A key highlight of the Xceed II is its optimization for die inspection, including System in Package (SiP), bare die, IPD, die attach, underfill fillet, and Cu Clip on die. This makes it the ideal solution for inspecting complex components found in next-generation electronics. Additionally, the system enhances 2D die inspection through advanced coaxial lighting, enabling more types of defect detection on the die’s top surface, including text, polarity, cracks, contamination, chipping, and epoxy issues.
According to PARMI USA, the Xceed II’s improvements in speed, precision, and die inspection optimization make it an ideal fit for today’s high-demand, high-precision manufacturing environments.
PARMI USA invites industry professionals to experience the Xceed II firsthand at its booth. There, attendees will have the opportunity to see how the Xceed II can enhance inspection efficiency, reduce defects, and improve production processes.
For more information about PARMI USA, INC. and the Xceed II 3D AOI system, please visit www.parmiusa.com.
