Speas’s IPCS (intelligent process strategy) system permits selective tests by tightly focused data evaluation and processing from the verification of board assemblies. Because of opportunity to considerably reduce test time, throughput can be increased while cost is reduced. The concept is based on the combination of AOI and flying-probe equipment, complemented by the ac-cess on data of the placement machines. The ”working relationship” between the individual systems is realized with special control andoperation software. Together with APC intraFactory, a module from Kratzer Automation, all data which is directly relevant for manufacturing of boards, is collected, managed (virtually and globally for all lines), and then selectively transmitted downstream or upstream to production machines. The manufacturing process is continuously monitored, analyzed and optimized on-line. IPCS is the solution in case of missing test pads, of large production quantities and to realize short cycle times. In the following, the characteristical fields of application are illustrated:
Selective process control – the test program is streamlined, depending on the production process. Flying-prober in combination with AOI system will be used. The flying prober does no longer verify every single component of a specific type, but makes a selective choice. In this case, it is required that a test is performed with the AOI before checking whether the corresponding component is present. Also,data of the placement machine is needed.
Selective test – dynamic execution of a test program, depending on the manufacturing quality-assurance requirements. The quantity of test needed depends on the actual defect rate. Test results are collected and saved. Based on the results, a test list is generated which can be dynamically reduced or extended, whatever fits.
Selective cluster test – reduced in-circuit test after functional test to quickly localize the defect sources. Depending on the results of the functional test, only some specific clusters are tested. The clusters are automatically selected, based on the defects that were found during functional test.
Selective re-test – reduced in-circuit test for assemblies that have gone the rework cycle. Depending on the defects having occurred before and the monitored repair process, only the relevant parts/functions are verified.(gbw)
