“High-speed, high flexibility and high angle autonomous inline and semi-inline X-ray inspection systems ensure the quality of component placement, solder reflow and selective soldering,” the company explained. Our systems offer MES/SECS-GEM integration and FLI connectivity to pass component fault locations directly to manual X-ray for second line, high resolution verification.”
2D and 2.5D inspection
The company’s solutions include 2D and 2.5D inspection for orthogonal (top-down) imaging for the inspection of simple cases, such as non-overlapping devices. With this method, oblique view image acquisition enables the inspection of PTH joints, head in pillow (HiP), overlapping parts on double sided PCBs and PoP/SiP design packages.
Planar CT
The ultimate solution for heavily overlapping devices. In case a simple 2.5D image does not provide a solution, the minimum number (max. 16) of off-axis images are captured, and a reconstruction is performed. Planar CT enables the inspection of horizontal and vertical slice images of the board, hence offering the possibility to separate parts overshadowing each other.
Slice-Filter-Technique (SFTTM)
Patented imaging technique to remove disturbing background structures of the inspection image. SFTTM offers an extremely fast alternative to filter out devices that are not being inspected and provides the possibility to analyse the part of interest.
