Plasma removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Fluid dispensing provides adhesion, structural integrity, thermal and electrical conductivity, and more in microelectronics manufacturing applications.
Plasma processing
The company‘s March FlexTRAK-CD plasma system delivers high-throughput plasma processing of strip-type components for semiconductor manufacturing applications, such as leadframe or laminate strips presented in magazines. Flexible chamber configurations support contamination removal, etching, and surface activation before die attach, wire bond, molding and encapsulation, and underfill applications.
Fluid dispensing
The Asymtek Vantage fluid dispensing system is used for applications in wafer-level packaging and panel-level packaging during semiconductor manufacturing. The Vantage system dispenses precise, fine lines to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly. When configured with dual IntelliJet valves, using the manufacturer’s jetting technology, the system can dispense into gaps less than 200 microns, and up to 90,000 dots per hour.
