Epoxy Technology’s Epo-Tek T3084-A2 is a wafer passivation material for semiconductor chips, formulated for environmental and mechanical protection of these dies. It also reduces the number of processing steps from seven to two during screen-printing of a wafer. The passivation is unique in that it offers a high Tg value combined with a low modulus. The result: a flat wafer due to low surface stress. Referring to tests, the coating material increase yields as much as 15% compared to spin-etch processing, according to the vendor. Additionally, the material offers lower cost compared to spin etch. Another new material, 5022-176, is available for a screen-printable non-conductive coating. It contains no solvents and has a shelf life of 6 months.
