Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth #2610 at the 2017 IPC APEX Expo, scheduled to take place Feb. 14–16, 2017 at the San Diego Convention Center in California. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free alloy and the associated high fluidity provides faster wetting and increased ability to spread over SAC305, which is beneficial in wave soldering and hand soldering applications, as well as, in reflow.
During the show, the company will display newly developed product that offers solutions for some of the challenges the electronics industry is now facing, such as, improvements in reliability and thermally stable joining.
SN100CVP506 D4 is a lead-free, no-clean solder paste with a basic composition of (Sn-Cu-Ni+Ge+Bi). This new alloy has an additional component that enables thermally solder joints to be stable even after thermal cycling. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The unique ability of the no-clean solder paste to survive long-term storage at room temperature allows simplification of stock management while meeting all the requirements of modern reflow soldering processes.