Designed to improve production flexibility, precision, and efficiency, the model allows manufacturers to safely depanel boards with tall connectors or components on the top side—cutting from the bottom to preserve clearance and component integrity. This capability is particularly valuable in high-reliability sectors such as automotive, industrial, and power electronics manufacturing.
The system also features a dual-table configuration, allowing for continuous operation by loading and unloading boards on alternating tables. Combined with automatic router-bit changes, blade diameter measurement, jig sensors, and image-processing camera teaching, it delivers advanced automation and high-precision results while reducing downtime.
Additional highlights include:
- maximum cutting area of 330mm x 400mm;
- cutting thickness from 0.4mm to 3.0mm;
- repeatability accuracy within ±0.01mm;
- router bit diameter support from 0.8 to 3.0mm;
- spindle speeds from 5,000 to 50,000 rpm; and
- optimized dust collection system under the bottom-cutting table.
The system is also compatible with DXF-based teaching, QR code reading for jig recognition, and traceability options, making it ideal for fully automated lines.
Michelle Ogihara, Executive VP at the company, commented: “The SAM-CT34XZ brings a new level of flexibility and capability to PCB separation. Its bottom-cutting feature opens up applications that previously required manual routing or special fixturing, and its dual-table design means it can keep up with modern high-mix, high-volume environments.”
