Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/News/Artikel
    New memory modules for rugged industrial applications
    Bildquelle nicht angegeben
    News

    New memory modules for rugged industrial applications

    Innodisk, a provider of industrial-grade memory solutions, has released its new DDR5 CAMM2 and LPDDR5X CAMM2 (LPCAMM2) memory modules. With 60% less space
    Veröffentlicht
    05. September 2025
    Lesezeit
    2 Minuten
    Rubrik
    News

    The CAMM2 series features a distinctive design. DDR5 CAMM2 and LPDDR5X CAMM2 consolidate dual channels on a single module, effectively combining the capacity and performance of two separate SODIMMs into a compact footprint. Despite handling a greater signal load, the modules feature a more simplified PCB routing that enhances signal integrity, resulting in cleaner and more reliable data transmission.

    Additionally, the new motherboard design, paired with the CAMM2 module, eliminates signal stubs caused by unused DIMM slots in traditional stacked configurations. The flat, board-hugging installation improves thermal contact and frees up space for customized cooling solutions.

    Powered by DDR5, the company’s CAMM2 delivers speeds of up to 6400 MT/s. The LPDDR5X version further boosts performance to 8533 MT/s, maintains the same 128-bit data width, and lowers operating voltage to 1.05 V. This advanced design improves power efficiency, reduces energy consumption, and extends system working hours. These features align well with the needs of Compact PCI, mini PC, rugged laptops, and fanless systems that demand high performance in compact, power-efficient designs.

    Furthermore, to facilitate easy maintenance and modular scalability, both CAMM2 and LPCAMM2 adopt a screw-lock design, which not only secures mechanical attachment but also improves vibration resistance and mechanical durability, making them well-suited for rugged environments such as aerospace and missioncritical applications. Additionally, LPCAMM2’s modular LPDDR5X architecture eliminates the need for full motherboard replacements, addressing the limitations of soldered memory designs.

    As a pioneer in bringing CAMM2 technologies to the industrial sector for embedded applications, the company is reinforcing its commitment to enabling industrial AI at the edge. To support the adoption of the new form factor, the company provides comprehensive after-sales service and flexible customization options. A stable and long-term supply further ensures that customers can integrate CAMM2 solutions with confidence.

    The modules will begin sampling in the fourth quarter of this year.

    www.innodisk.com

    Mehr aus News

    Weitere aktuelle Artikel aus der Rubrik News.

    Alle News-Artikel
    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in GermanyFoto: Laurens van der Drift / Unsplash
    News

    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in Germany

    9. November 2026

    German distributor Microtronic has announced it will represent iRaptor LDA and its EYE thermal profiler in Germany. The Portuguese developer's system extends beyond conventional 2D time-temperature profiling by…

    Indium Corporation Presents Solder Materials Research at SMTAI 2026Foto: Indium Corporation
    News

    Indium Corporation Presents Solder Materials Research at SMTAI 2026

    29. Oktober 2026

    Indium Corporation is fielding five specialists at SMTA International 2026 to present new findings on solder paste rheology, BGA ball alloy selection for lower-temperature reflow, and the effect of print gap on paste…

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026Foto: Vishnu Mohanan / Unsplash
    News

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026

    16. Oktober 2026

    KYZEN will exhibit its AQUANOX line of aqueous electronics cleaning chemistries at SMTA International, October 27–29, 2026, highlighting prolonged bath life as a process efficiency and cost-reduction lever for…

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT LinesFoto: Cybord
    News

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT Lines

    29. August 2026

    Fuji America Corporation and Cybord have announced a strategic partnership to embed AI-powered component analytics directly into SMT production lines, enabling 100% real-time inspection of electronic components during…

    ← Zurück zu NewsZur Startseite