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    Startseite/Semiconductor-packaging/Artikel
    Nanoscribe Expands Photoresin Portfolio for Micro-Optics Fabrication via Two-Photon Polymerization
    Foto: Brecht Corbeel / Unsplash
    Semiconductor-packaging

    Nanoscribe Expands Photoresin Portfolio for Micro-Optics Fabrication via Two-Photon Polymerization

    Five industrial-grade resins now available with batch-specific Certificates of Analysis for PIC-compatible micro-optical components
    Veröffentlicht
    11. November 2026
    Lesezeit
    1 Minute
    Rubrik
    Semiconductor-packaging

    Nanoscribe offers five core photoresins for micro-optics production, each addressing specific performance requirements. The newly introduced IPX-Clear targets 3D printing of micro-optics and coupling structures with high transparency, while IP-n162 provides a high refractive index for hybrid optics applications. IP-Dip2 is positioned for the finest microoptical structures requiring maximum resolution, and IPX-S serves 2.5D micro-optics as functional prototypes or replication masters. IP-S covers general-purpose coupling structures and fiber optics. All five are manufactured to industrial-grade quality and supplied with batch-specific Certificates of Analysis (CoAs), addressing reproducibility demands in production environments.

    The resins are formulated to deliver precisely defined refractive index and dispersion characteristics alongside minimal shrinkage and high surface quality — critical parameters for photonic integrated circuit (PIC) packaging and optical interconnect applications. Compatibility across major PIC substrate platforms broadens their applicability in semiconductor and advanced packaging workflows. OrmoComp, a third-party high-transparency photoresin from micro resist technology, rounds out the portfolio.

    Quelle: Nanoscribe (semicon) – https://www.nanoscribe.com/en/products/optics-manufacturing-2pp-printing-materials/

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