Advanced Packaging Conference
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency
Demand for High Performance Computing (HPC) is increasing, driven by advancements in artificial intelligence and Large Language Models like ChatGPT. HPC’s expansion requires innovative solutions in chiplet design, heat dissipation, and power optimization. The upcoming APC will provide a platform to explore enhancing each of these developments, highlighting collaboration among academia, industry, and government.
This year’s APC will focus on:
- The Role of Chiplets in Enhancing Performance and Efficiency
- Power Optimization Techniques for Next-Generation Applications
- Advances in Miniaturization and Material Integration
- Innovations in Heat Dissipation and Thermal Management
- Collaborations Across Academia, Industry, and Government
Speakers include experts from Amkor Technology, ASE Global, Atotech an MKS Brand, Besi, Chip Integration Technology Center (CITC), Comet Yxlon, EV Group (EVG), Evatec, GlobalFoundries, Guangdong Fenghua Semiconductor Technology, Henkel, IBM, Infineon Technologies, JCET, Koh Young Europe, QuantumDiamonds, RHP-Technology, RoodMicrotec, Robovision, STATS ChipPAC, and SUSS MicroTec.
The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, IBM, Koh Young Europe and SUSS MicroTec.
Fab Management Forum
Driving Innovation: Competitive, Sustainable and Collaborative Strategies
To meet evolving demands, the semiconductor industry must adopt competitive, sustainable, and collaborative strategies that enhance fab efficiency and performance. Industry stakeholders can develop innovative solutions for a sustainable future by integrating cutting-edge technologies and fostering partnerships.
This year’s FMF will focus on:
- Key Strategies in a Global Market Landscape
- Advancing Smart Manufacturing Solutions
- Europe‘s Environmental Transition: Stability to Sustainability
- Next-Gen Core Technologies for Future Fabs
Speakers include experts from Algorismic, ams OSRAM, BMW Group, Comet Yxlon, Flexciton, Infineon Technologies, INFICON, imec, Kontron AIS, minds.ai, Robert Bosch Semiconductor Manufacturing, STMicroelectronics, Synopsys, Texas Instruments, Tokyo Electron Europe, Watlow, and X-Fab.
The forum is sponsored by Comet Yxlon, Flexciton, INFICON, Lynceus, Tokyo Electron Europe (TEL), and Watlow.
