Microtronic M. V. GmbH has increased its analytical throughput for scanning acoustic microscopy (SAM) by adding Sonix ultrasound microscope systems to its service portfolio. The expanded capacity targets defect detection in electronic assemblies and components, covering voids and delaminations in underfill, solder, die attach and mold compound, as well as cracks and popcorn defects.
The analysis process immerses components in a pure-water tank and scans them with an ultrasonic transducer; reflected signal amplitude and time-of-flight data are processed to generate cross-sectional images, which can be evaluated automatically or manually. Results are made available via a secured server download, with detailed reporting available on request.
Microtronic positions the expanded SAM service alongside its existing offerings in solderability testing, ionic contamination analysis, RF induction soldering and SMD manufacturing support, aiming to provide fast-turnaround, cost-competitive failure analysis to European electronics manufacturers.
Quelle: Microtronic (semicon) – https://www.microtronic.de/index.php/news/299-microtronic-m-v-gmbh-baut-kapazitaeten-fuer-die-analyse-mit-ultraschallmikroskopen-von-sonix-erheblich-aus
