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    Startseite/Semiconductor-packaging/Artikel
    Micross Acquires PAAL Technologies and Expands its Hi-Rel Components Offering
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    Semiconductor-packaging

    Micross Acquires PAAL Technologies and Expands its Hi-Rel Components Offering

    Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space,
    Veröffentlicht
    14. Juni 2022
    Lesezeit
    2 Minuten
    Rubrik
    Semiconductor-packaging

    PAAL has established itself as a best-in-class supplier of MIL-STD-1553 Data Bus Couplers, Harness Assemblies and RF/Wideband transformers serving the most demanding applications for the Defense, Aerospace, and Space markets. In addition, their product offering is highly engineered, with a meticulous understanding of high frequency magnetics, and extensive experience serving the space requirements of the military primes and system level contractors. All products are designed and manufactured in the U.S., and PAAL maintains full documentation traceability for design, development, fabrication, test and inspection. PAAL’s operating facility has ISO9001 and AS9100 quality certifications.

    “We are excited to join the Micross family, enabling us to provide our valued customers with a direct sales channel and support organization that is focused on high-reliability solutions. I am confident that engineering designers, as well as program and procurement managers will benefit from the extensive capabilities, resources, and new product lines available from our combined organization,” said Estro Vitantonio, President of PAAL Technologies.

    Vincent Buffa, Chairman & CEO of Micross, stated, “The acquisition of PAAL Technologies will expand Micross’ market-leading portfolio of high-reliability microelectronic solutions, delivering synergies that will benefit our high reliability customers. Micross is uniquely positioned to provide customers with greater value by leveraging our diverse portfolio of products and services to meet all their microelectronic program and operational needs, including fully integrated packaged components and kitted solutions.”

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