Established in 1985, the company has evolved from a sales office into a vital innovation and production hub for semiconductor packaging materials, contributing to global advancements in smart technology, sustainable energy, and communications mobility. In 2021, it cemented its position with the inauguration of a Center of Excellence for Advanced Packaging in Singapore.
In addition to its strong foundation in manufacturing and R&D, the company supports regional business activities by integrating essential global and regional functions such as sales, customer solutions, supply chain, marketing, and strategy development.
“For four decades, we have partnered closely with customers and suppliers to create the future through materials innovations,” commented Li-San Chan, Global Business Line Head, Semiconductor Materials. “Singapore provides a stable environment and respect for intellectual properties that are critical to supporting our customers globally. This celebration is a reflection of our successful journey and a bold step forward as we shape the next generation of advanced materials.”
The seminar, held at Conrad Singapore Marina Bay, featured presentations on the company’s latest technologies and product developments, alongside a showcase of real-world applications that are transforming the way we live, work, and communicate.
Kelly Lai, Vice President for Chemicals and Materials at the Singapore Economic Development Board, expressed admiration for the strong partnerships built by the company over the last four decades, noting that the contribution has helped to position Singapore as a hub for advanced manufacturing and innovation.
Lai added: “The establishment of its Centre of Excellence for Advanced Packaging in 2021 underscores Heraeus’s commitment to deepening its footprint here. As a key materials partner in Singapore’s growing semiconductor ecosystem, Heraeus plays an important role in advancing industry capabilities. We welcome like-minded partners to harness Singapore’s strengths in talent, infrastructure, and global connectivity to develop cutting-edge material solutions for the world.”
