High flexibility and high resolution
According to the company, the Quadra Series enables manufacturers to manually inspect hidden solder joints to confirm optimal reflow and process setup; verify rework and selective soldering and perform failure analysis and reverse engineering. “Our manual X-ray Inspection products are quick to use as they employ easy to setup automatic inspection recipes. Overall, they are ideal for high mix, lower volume inspection and ultimate image resolution.”
2D and 2.5D inspection
2D top down views make it easy to see voiding, and defects such as opens and bridging. 2.5D oblique angle is great for inspecting fill level, identifying head in pillow (HiP) defects and cold joints.
X-Plane 3D
View individual 2D slices anywhere on the board. X-Plane image slices filter out other components that may obscure the view, for example on the other side of the PCB. Review slices at the top and bottom of BGA joints to see interfacial voiding. Side on slices make it easy to confirm head in pillow defects.
3D µCT
The ultimate technique for failure analysis. The µCT accessory is quick to use and allows you to see features that are obscured in 2D and 2.5D images. Open up a whole new world of failure analysis inspection.
Click here for more about the Manual X-ray Inspection (MXI) QuadraSeries
Or to find out more about the company’s other T&I Solutions – SMT3D 2022.pdf
