Advancing performance
The new alloy represents a breakthrough in reliability, offering enhanced thermomechanical performance to meet the increasing rigorous demands of electronic assemblies. Surpassing traditional options like SAC305 and other high-reliability alternatives, the company says the new alloy delivers exceptional thermal cycling, vibration, and drop shock performance. In addition, it achieves high creep-fatigue resistance, through a refined microstructure, making it ideal for the most demanding ruggedized applications.
Driven by industry demands
The development of the product was inspired by the complex challenges present in sectors spanning automotive, aerospace, high-end computing, and industrial applications, where reliability is critical. Environments with severe stress on solder joints underscore the need for Innolot MXE, as traditional alloy options are limited in performance and durability. This solution offers a higher margin of performance to enhance in-use life and advance board level reliability.
- Innolot MXE addresses new challenges in safety-critical systems, miniaturization, and harsh operating environments, setting a new standard for performance.
- Enhanced Creep Fatigue toughness inhibits crack propagation and improves thermal cycling performance as compared to SAC305 and other high-reliability alloys.
Available in solder paste
To complement its thermomechanical performance, the new alloy is available in combination with ALPHA CVP-390V solder flux. This offering presents an unparalleled blend of high-performance alloy and solder paste chemistry, ensuring unmatched electrochemical reliability even in the most demanding scenarios.
