Nordson Dage, Matrix, and Yestech, divisions of Nordson Corporation, will exhibit at productronica 2017. The Test & Inspection team will showcase a suite of systems including the Quadra 5 and 7 X-ray inspection systems, the Inline X-ray inspection platform XS-series complemented by the X#-series and XCT-1000, as well as, the FX-940 ULTRA 3D AOI system. On the bondtester side, the company will demo the 4800 configured for ball shear on a 300 mm wafer and a 4000Plus bondtester configured for battery testing.
Nordson Dage’s Quadra 7 represents the cutting edge of X-ray inspection performance. 6.7 MP ultra-high quality images are displayed at full one-to-one resolution over two 4K UHD monitors ensuring the clearest features.
The Quadra 5 offers high performance and ease of use for 2D and 3D X-ray applications. 0.35 μm feature recognition up to 10 W of power, makes it a leading choice for printed circuit board and semiconductor package inspection.
The 4800 Advanced Automated Wafer Testing bondtester is at the forefront of wafer testing technology catering for the testing of wafers from 200 mm up to 450 mm. Advanced technology guarantees unsurpassed accuracy and repeatability to provide total confidence in product quality. A range of powerful camera and optical systems optimize load tool alignment, auto programming, and post-test analysis make this system the pinnacle of automated wafer testing. The 4000Plus bondtester with Camera Assist Automation is ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid microcircuits, or automotive electronic packages.
Nordson Matrix will present the XS-series, a high-speed in-line automated X-ray inspection platform designed to achieve a smaller footprint (1300 mm width) for small and medium board sizes (350 x 250 mm) targeting automotive and semi-backend applications. It allows high-speed 2D/2.5D/3D X-ray inspection of PCB-assemblies, samples in trays, as well as, hybrid applications. Newly designed sample table and linear driven detector motion system allow outstanding 2.5D & 3D imaging speed.
The X#-series is the most flexible AXI platform series in the company’s product portfolio. The system is available with two different handling modes (left in – right out/left in – left out) and is equipped with a verification terminal at its output. The embedded Barcode scanning gantry (BCR) enables automated scanning of product bar codes, provides the ability to add product changeover flexibility, and increases system throughput. With the showcased X2.5# high power setup, the company presents a sustainable solution for the inspection of power hybrid applications (e.g. IGBT), which has become a demanding requirement in the automotive industry.
The XCT-1000, representing the company’s XCT-series, complements the existing AXI portfolio with CT-technology. This platform is especially suitable for the inspection of small to medium production volumes, sample tests, or for the use in laboratory environment. The XCT-1000 HR will be introduced at the show, that has a dedicated setup for super-high resolution applications (μ-solder-joints on PCB or Flex, wire-bond inspection, wafer-bumps). Implementing the latest model of the Dage tube as X-ray source and digital flat panel technology accomplish CT-Voxel-resolutions less than 1 μm.
The Nordson Yestech FX-940 Ultra 3D AOI with 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs, and other height sensitive devices. With its Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-color digital image processing, and both image and rule-based algorithms, it offers complete inspection coverage with 2D and 3D defect detection.
The company’s M1m AOI system offers high-speed microelectronic device inspection with exceptional defect coverage. With resolutions down to submicron levels and telecentric optics, it provides complete inspection, all within a footprint less than 1 m2.
productronica, Booth A2.445
